• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present disclosure relates to a hollow board 1 with first and second main surface layers 3, 5. A plurality of distance elements connecting the first and second main surface layers and maintain a predetermined distance there between. The main surface layers include at least a layer of high-density fiber, HDF, board, and a plurality of distance elements are distributed in the space between the main surface layers, and at least some comprise at least one elongate HDF board strip 15 which is oriented such that its longitudinal edges interconnect the first and second main surface layers 3, 5. The HDF boards of the surface layers and of the at least some of the distance elements comprise wood particles bonded by a resin including an isocyanate, such as methylene diphenyl di-isocyanate, MDI.
    公开号:SE1650917A1
    申请号:SE1650917
    申请日:2016-06-27
    公开日:2017-12-28
    发明作者:Pettersson Dan
    申请人:Ikea Supply Ag；
    IPC主号:
    专利说明:

    HOLLOW BOARD Technical field The present disclosure relates to a hollow board, comprising first and second surfacelayers and a plurality of distance elements connecting the first and second surfacelayers and maintaining a predetermined distance between the first and second sur- face layers.
    BackgroundSuch a board is disclosed for instance in WO-2010/049418-A1, describing a board making up a furniture element with first and second main sides. The board has a sup-porting structure comprising a number of longitudinal bodies and a hollow distancematerial placed in between the longitudinal bodies. The longitudinal members mayconsist of wood or a board material, and a honeycomb cardboard may constitute thedistance material. A board material which may be laminated with a foil is adapted tobe folded over and glued on the supporting structure to provide the surface layers ofthe first and second sides as well as one or more of the board edge surfaces. Whenthe board is finished the support structure maintains a predetermined distance be-tween the surface layers of the first and second sides, and the board thereby has a considerable bending stiffness despite being very light.
    A general problem in this technical field is how to provide an improved board. Animprovement may mean a board that is one or more of lighter, stronger, lessexpensive to produce, having an improved capability of being used in a broad range of working environments, or having a lesser environmental impact.
    SummagOne object of the present disclosure is thus to provide an improved hollow board.
    This object is achieved by means ofa hollow board as defined in claim 1. Morespecifically, in a board of the initially mentioned kind, each main surface layer mayinclude at least a layer of fiberboard having a density of at least 800 kg/ms (HDFboard), and a plurality of distance elements may be distributed in a space betweenthe main surface layers. At least some of said plurality of distance elementscomprises at least one elongate HDF board strip being oriented such that itslongitudinal edges interconnect the first and second main surface layers. The HDF boards of the surface layers and at least some of said distance elements comprise wood particles bonded by a resin including an isocyanate component. lt has been found that by using a resin with an isocyanate component, rather than thetypically used formaldehyde based resins, a hollow board that is less affected bychanging humidity, in particular high humidity and high temperatures, can be achiev-ed. This allows a board to be used all over the world, while retaining its form andstrength. By arranging the distance element board strips such that their longitudinaledges interconnect the main surface layers, this effect is enhanced. Any swelling thatmay still take place in the strip will to a great extent occur in the direction that thestrip material was pressed, and this does not affect its function as a distance ele-ment. For instance, it can be avoided that the swelling of the board strip cracks a surface layer on the side edge surfaces of the hollow board.
    The HDF board strip may extend in a plane perpendicular to the plane of the first andsecond main surface layers. This provides a local l-beam which entails a hollowboard with high bending stiffness about an axis perpendicular to the direction inwhich the board strip extends. The hollow board may therefore have a main directionof extension and the HDF board strip an elongate direction being parallel with the main direction of extension.
    The HDF board strip longitudinal edges, that interconnect the main surface layers,may be cut edges formed by cutting the strip from a HDF board. The strip sidefaces/edges being perpendicular to the longitudinal edges may have a smoothersurfaces than the cut longitudinal edges, preferably the strip side edges may bepress formed side edges. The rougher cut longitudinal edges are well suited for being glued to the main surface layers.
    The HDF board strip may extend along at least 80 %, preferably at least 90%, of thetotal length of the board in the main direction of extension, thus providing a very strong board.
    The plurality of distance elements may include at least one stack of glued togetherHDF board strips, wherein the stack is oriented in between the first and secondsurface layers such that individual board strips in the stack interconnect the first andsecond surface layers. This provides the same advantages of mainly swelling in a direction that does not affect the hollow board structure as does the single HDF board strip, but also a wider piece that may allow the use of connector elements.Typically, the stack of glued together HDF board strips may comprise 3-10 individualHDF board strips. This provides a suitable thickness of the stack, to provide extrastrength thereof.
    A stack may adjoin a side edge of the board. An advantage of this embodiment isthat the stack reinforces the side edge of the board and makes it more resistant to impacts etc.
    Preferably the stack may have a length (L) of less than 20% of the total length of theboard. This reduces the weight of the board, in particular in applications where the stack is needed mainly for local reinforcement of the board.
    Preferably the stack may have a width (W) of less than 20% of the total width of theboard. This reduces the weight of the board, in particular in applications where thestack is needed mainly for local reinforcement, and/or is needed for side edgereinforcement of the board.
    At least one connector element may be machined in the hollow board at the locationof a block located between the first and second surface layers. This block couldpreferably be a stack of glued together HDF board strips. The at least one connectorelement extends at least partly into the block, for example the stack of glued togetherHDF board strips. The fact that the connector element is at least partly machined inthe block, such as in a stack of glued together HDF strips, makes the connectorelement stronger and allows the hollow board for instance to be connected to other furniture components in a secure manner.
    Preferably the at least one block has a length (L) constituting less than 20% of thetotal length of the hollow board. This provides for a block that is located locally wherethe connector element is needed, thereby not adding unnecessary weight to the board.
    Preferably the at least one block has a width (W) constituting less than 20% of thetotal width of the hollow board. This too provides for a block that is located locally where the connector element is needed, thereby not adding unnecessary weight.
    The stack of HDF board strips may be glued together using a polyurethane based reactive hotmelt glue.
    Typically, the plurality of distance elements may include both at least one stack ofglued HDF board strips and at least one distance element comprising a single HDF board strip, the latter being spaced apart from said at least one stack.
    The first and second main surface layers and at least one side edge surface of thehollow board are preferably made from a single piece of HDF board. A method andan arrangement for folding a board to form first and second main surface layers is,for example, described in Swedish patent application No. SE 1550962-3. This, inaddition to providing an efficient manufacturing procedure, verifies that the mainsurface layers always come from the same batch of HDF board, and thus haveidentical water content, etc., when being assembled into a hollow board. Thisprovides an improved quality as the main surface layers will behave identically once being attached to each other with the distance elements therebetween.
    The isocyanate component of the resin may comprise at least one component select-ed among methylene diphenyl di-isocyanate (MDI) and polymethylene polyphenyleneisocyanate. These types of isocyanate components have proven very efficient forobtaining a hollow board with good humidity resistance. Preferably the resincomprises at least 30% of polymethylene polyphenylene isocyanate and/ormethylene diphenyl di-isocyanate (MDI). This provides for further improved humidityresistance. Still more preferably the resin comprises a 4, 4'-methylene diphenyl di-isocyanate isomer, and/or a polymethylene polyphenylene isocyanate that has beenformed from a 4, 4'-methylene diphenyl di-isocyanate isomer. The 4, 4'-methylenediphenyl di-isocyanate isomer and polymers made therefrom are particulary efficient forforming strong and humidity resistant hollow boards.
    The HDF board may comprise 0.5-15, more preferably 2-10, and most preferably 3-7,wt%, excluding any water, of resin containing the isocyanate component. ln thiscontext the “wt% of resin” is calculated excluding any water, for example excludingany water forming part of the resin formulation and excluding any water used to makean emulsion from the resin before mixing it with the wood fibers. The term “excludingany water” means, hence, that any water added to the resin formulation, for exampleto make an emulsion for making it easier to supply the resin to the wood fiber, isdisregarded when calculating the “wt % of resin”. ln other words, the "wt% of resin” refers to the amount of “water free” resin. The above noted resin contents have been found to provide a strong HDF board, without undue cost, that has good resistance to humid environments.
    Preferably the HDF board has a density of 850-1050 kg/m3. These densities havebeen found to provide a strong board suitable for producing hollow boards that are strong and have a low weight.
    Preferably the HDF board has a thickness of 0.5 - 6 mm, more preferably 1-3.5 mm.These thicknesses have been found suitable for manufacturing a hollow board that is strong and has a low weight, and is still resistant to humid environments.
    Preferably the HDF board comprises at least 50 wt%, more preferably at least 80wt%, of dry wood fibers. While the HDF board may comprise other components, forexample scrap plastics, the HDF board becomes stronger, and its behavior morepredictable the more wood fibers it comprises. This is beneficial for the strength and humidity resistance of the hollow board.
    At least one distance element may be glued to the first and second main surface layers using a hotmelt glue, preferably a polyurethane based reactive hotmelt glue.
    Preferably all distance elements are made from HDF boards comprising woodparticles bonded by a resin including an isocyanate component. When all distanceelements of the hollow board are made from this material the hollow board obtains predictable properties, and very good resistance to humid environments.
    Brief description of the drawinqsFig 1 illustrates schematically in perspective a board that can be used as a furniture component.
    Fig 2 shows in perspective a partial cut-out of a hollow board according to the pre- sent disclosure.Fig 3 illustrates schematically a HDF board according to the present disclosure.Figs 4a-7 illustrate enlarged details of the board in fig 2.
    Fig 8 shows schematically a cross section through a connection between a main surface layer and an HDF board strip.
    Detailed descriptionThe present disclosure relates to a hollow board that can be used as a furniture com- ponent. Typically, the board can make up a tabletop, a shelf, a panel in a kitchencabinet, a door, etc. Many other applications exist. Fig 1 illustrates schematically inperspective such a hollow board 1. The hollow board comprises a first 3 and asecond 5 main surface layer, and generally makes up a flat rectangular cuboid, eventhough deviations from rectangular shapes, e.g. a parallelepiped could be conceiv-able. The main surface layers may be quadratic or may as illustrated be elongatedhaving a main direction of extension 7 in which the board has its largest dimension. ln the flat, rectangular cuboid, the first and second main surface layers may in mostcases be interconnected at their four edges by edge surface layers 9, 11, although itcould be conceivable in some applications to forego from using one or more of theedge surface layers, leaving an opening between the main surface layers at thoseIocations. ln most cases, the main surface layers make up most of the outer surfacearea of the board.
    The board is hollow meaning that a lot of air is enclosed therein, or in principle ano-ther gaseous medium. This provides a much lighter board as compared to a solidone. Still, a reasonable bending stiffness can be achieved as the mutual separationof the main surface layers 3, 5 provides an increased second moment of area, as compared to if the main surface layers were not separated. ln order to provide structural stability, distance elements are provided, not only at theedges of the board, but spread out in the space between the main surfaces layers ofthe board, as will be discussed. Thus, there is provided a plurality of distanceelements connecting the first 3 and second 5 main surface layers and maintaining a predetermined distance there between. ln the present disclosure, the main surface layers 3, 5 as well as at least somedistance members comprise a fiberboard having a density of at least 800 kg/m3, alsocalled high density fiber board or HDF board.
    Fig 3 illustrates schematically a HDF board 13 according to the present disclosure.The HDF board 13 is produced by mixing wood fibers/particles such as chips or sawdust with a resin at a raised temperature. The mixture is pressed in the illustrated z- direction at a pressure of several MPa while the resin cures. The pressing of the board 13 forms opposite pressed large faces 13a, 13b that may be smooth, as aresult of the pressing. The finished product will have very uniform properties over its entire surface. ln the present disclosure, the HDF board material may be about 2.0 mm thick, or within the range 1.0 to 2.4 mm, or more preferred within 1.5 to 2.2 mm.
    Even though the HDF board may be used on its own, it may as well be laminatedwith other materials. For instance, the HDF board surfaces that will make up theouter surface of the hollow board may be laminated with a decorative foil, such as apolypropylene foil or polyolefin foil or another suitable foil that provide a desired property such as being hydrophobic. Veneer is another possible option.
    “HDF board” as used in the current application means a fiberboard material having adensity of at least 800 kg/m3. According to a preferred embodiment the HDF boardhas a density of 850-1050 kg/mß. ln many cases, conventional HDF boards as well as medium-density fiber, MDF, boards have been produced using a urea formaldehyde composition resin. ln the present disclosure a resin comprising an isocyanate component has beenfound to provide useful properties for a hollow board. It has been found that a HDFboard produced with this resin has a lower hygroscopic expansion than has a boardproduced with a urea formaldehyde composition. This is an important advantage ifthe product for instance is produced under conditions with low temperatures and lowhumidity, and is subsequently used under conditions with high temperatures and highhumidity. ln a case where a significant swelling takes place it is likely for instance thata laminated foil on an edge surface cracks, as such a foil, particularly if made in aplastic material, itself does not expand substantially due to the increased humidityand temperature. Further, in some cases, the swelling may render the board useless,for instance if it does not longer fit together with another component that is not affect-ed in the same way. Still further a HDF board produced with a resin comprising anisocyanate component has also been found to have a higher Modulus of Elasticity at high relative humidity, compared to prior art HDF boards.
    More particularly, the isocyanate component may comprise polymethylene poly-phenylene isocyanate (also called lsocyanic acid, Polymethylenepolyphenylene ester) and/or methylene diphenyl di-isocyanate, MDI. ln case the isocyanate com- 7 ponent of the resin comprises methylene diphenyl di-isocyanate then it is preferablythe 4,4' isomer thereof (4,4'- methylene diphenyl di-isocyanate). Working examples involving the above referenced isocyanate components will be described hereinafter.
    Details of an example of a structure according to the present disclosure will now bedescribed with reference to fig 2 showing a hollow board with one main surface layerpartially cut away, and figs 4a-8 showing enlarged details of fig 2. Fig 4a showsenlarged the detail A in fig 2.
    A plurality of distance elements 14 may be distributed in a space 16 formed betweenthe main surface layers 3, 5. Those distance elements may include, as shown in fig4a, an elongate HDF board strip 15 produced as mentioned above. This strip 15 hasa width corresponding to the distance between the main surface layers 3, 5, and isoriented standing on its edge such that its longitudinal edges 17 interconnect the firstand second main surface layers 3, 5 such that the space 16 is formed between them.The HDF board strip 15 extends in a plane perpendicular to the planes of the firstand second main surface layers, and its longitudinal edges 17 are glued to the mainsurface layers 3, 5. This may be achieved by e.g. applying a layer of glue to the innersurfaces of the first and second main surface layers 3, 5. A polyurethane basedreactive hotmelt glue, such as RAPIDEX® HL 9554 F, available from H.B. FullerEurope GmbH, Zurich, CH, may be used to this end.
    While it would be possible to use a wider HDF board strip that is inclined with respectto the direction perpendicular to the planes of the first and second surface layers, theperpendicular configuration is structurally preferred. By gluing the HDF board stripsuch that it extends in a plane perpendicular to the planes of main surface layers, alocal l-beam is formed where the HDF board strip constitutes the beam web and themain surface layers constitutes the beam flanges. This configuration provides signi-ficant bending stiffness about an axis that is parallel to the plane of the main surface layers and perpendicular to the direction in which the HDF board strip extends.
    When, as illustrated in fig 1, the hollow board has a longitudinal direction 7 of ex-tension, the HDF board strip 15 may run straight and in parallel with this direction 7.This allows the board to take up a greater load, for instance if used as a bookshelf. ltmay be preferable to let the HDF board strip extend along the full length of the hollow board, from one short edge 11 to the other, and to glue the ends of the strip to the board making up those short edges. However, this is not necessary to obtain an im-proved bending stiffness. For instance, an 80 % extension of the length of the boardmay be enough for some applications. A plurality of HDF board strips 15 may beused spaced apart at even distances over the surface.
    Another advantage of arranging an HDF board strip 15 in this way is that most of thehygroscopic expansion that may take place, despite the choice of resin, will takeplace in what was the z-direction of the HDF board 13, as illustrated in fig 3, fromwhich the HDF board strip 15 was derived. This is due to the board 13 being pressedin this direction during production. Any hygroscopic expansion of the HDF board strip15 taking place in what was the orthogonal x- and y-directions of the HDF board 13,see fig 3, from which the HDF board strip 15 was derived will most likely be negligiblein comparison. This means that the HDF board strip 15 illustrated in fig 4a can beallowed to expand almost without affecting the hollow board at all, because any suchexpansion of the board strip 15, occurring in the z-direction of the original HDF board13, will occur in an expansion direction ED being parallel to the plane of the surfacelayers 3, 5, meaning that the expansion will occur in the hollow space availablebetween adjacent distance elements 14. Fig. 4b illustrates this preferred arrange-ment of the HDF board strip 15, as seen in cross-section, in which the longitudinaledges 17, that are to be glued to the main surface layers 3, 5, are cut edges, with adegree of roughness caused by cutting the board strip 15 from a large board, such asthe board 13 illustrated in fig. 3, while the side faces/edges 18 of the board strip 15are surfaces formed already in the HDF board forming process, i.e. the sidefaces/edges 18 originate from the pressed large surfaces 13a, 13b of the board 13illustrated in fig. 3, and are as such more smooth than the longitudinal edges 17. Thecutting of the strips 15 from the large board 13 could be made by means of a saw, a knife arrangement or any other suitable means.
    There may also be provided as distance elements stacks 19 comprising glued HDFboard strips 15, which may be glued together using the same glue as is used toattach the single strips 15 to the main surface layers 3, 5. The stack 19 is oriented inbetween the first and second surface layers such that individual board strips in thestack interconnect the first and second surface layers, i.e. the individual layers in thestack are oriented in the same way as the single strips. Such stacks 19 form laths that provide additional strength where needed. As shown in fig 2 this may be useful 9 at side edges of the hollow board and at other locations where the hollow board need be connected to other components as will be discussed.
    Fig 5 shows enlarged the detail B in fig 2. A block in the form of a short stack 21 ofHDF board strips may as shown be arranged to adjoin an edge 11 of the board. Theshort stack 21 may as illustrated be glued to another stack 19, and is used to providebasis for a connector element, in the illustrated case a hole 23 for a screw or the like.The short stack 21 is therefore only needed in the vicinity of the location of theconnector 23. ln an alternative embodiment, a connector 23 is located at an arbitraryposition in a main surface layer 3, 5, for example to support a shelf ofa book shelf orto support a handle of a door. lf so, the short stack is only needed at that location,and does not need to adjoin an edge. Preferably the short stack 21 may have alength L extending less than 20% of the total length of the board in the extensiondirection of the stack strips, or in any case the short stack 21 extending less than halfof the total length of the board. Such a short stack 21 therefore adds only little extraweight and still may provide a useful additional function. ln general, the stack 19,21width W, as seen perpendicular to the extension direction of the stack strips of thestack 19, 21, may preferably extend less than 20% of the total width of the board to save weight.
    As alternative to, or in combination with, a block having the form of a short stack 21made from glued together HDF board strips, a block may also be made from othermaterials. For example, a block may be made from plastic or metal, and may belocated between the surface layers 3, 5 for the purpose of providing various function- alities, for example as will be described hereinafter.
    Connector elements may also be added in the main surface layers. Fig 6 showsenlarged the detail C in fig 2. Here connector elements in the form of drilled holes 25are provided in the main surface layer 3 at a location where a stack 19 of glued HDFboard strips is provided beneath the main surface layer 3. Such holes 25 may forinstance be used to fit plugs or screws for connecting the hollow board to anotherelement. Another example is illustrated in fig 7 showing enlarged the detail D in fig 2.Here a connector element in the form ofa groove 27 is provided in the main surfacelayer 3 at a location where a stack 19 of glued HDF board strips is provided beneaththe main surface layer 3. ln such a groove 25, a HDF boar may be slid in, forin- stance.
    Fig 8 shows a cross section through a connection between an HDF board strip 15and a main surface layer 3. As illustrated, the main surface layer 3 comprises a mainsurface layer HDF board 29 with a main surface layer foil 31 laminated thereon topresent the outer surface 35 of the main surface layer 3. A glue layer 33 is providedon the inner surface 37 of the main surface layer 3, and adheres to the HDF boardstrip 15, at least to the strip edge 17 thereof. The glue layer 33 is thus applied just before the board strips 15 are assembled with the main surface layer 3.
    Example 1 An HDF board was produced in the following manner: Wood based fibers having anaverage length of about 5-20 mm and an average diameter of about 0.05-0.3 mmwere formed by pressing, and refining wood chips and then drying the resulting fibersaccording to normal HDF production procedures. The wood fibers were mixed with aresin called l-BOND® MDF EM 4330, which is available from Huntsman Holland BV,Botlek-Rotterdam, Netherlands. This resin comprises, as a major active ingredient,Polymethylene polyphenylene isocyanate (CAS: 9016-87-9) (sometimes alsoreferred also to as lsocyanic acid, Polymethylenepolyphenylene ester). The resultingwood fiber mixture comprised about 5.5wt% moisture, 4.5wt% resin, excluding anywater, and the remaining part, i.e. 90 wt%, was dry wood fibers. This wood fibermixture was used to form a fiber mat of 12 mm thickness, which was introduced intoan HDF board press. The fiber mat was, during a period of about 3 seconds,exposed to a high pressure treatment which involved exposing the fiber mat to apressure that increased up to 4 N/mmz and that was then reduced again. Thetemperature was about 200°C during this initial high pressure treatment. After thehigh pressure treatment the pressure was about 0.4 N/mm2 and this pressure wasmaintained for about 5 seconds, combined with a temperature of about 160°C. Thenpressure was increased to about 1.5 N/mm2, temperature was maintained at about160°C, and this final pressing was performed during about 9 seconds. ln total thepressing occurred during 3+5+9 =17 seconds, and the resulting HDF board had athickness of about 2 mm, a density of 940 kg/m3 and a moisture content of about 4wt% after pressing.
    Example 2 11 Wood fibers were prepared in a similar manner as in Example 1. The wood fiberswere mixed with a resin called l-BOND® MDF PM 4390 available from HuntsmanHolland BV, Botlek-Rotterdam, Netherlands. This resin comprises, as major activeingredients, Polymethylene polyphenylene isocyanate (CAS: 9016-87-9), (sometimesalso referred also to as lsocyanic acid, Polymethylenepolyphenylene ester), and 4,4'-l/Iethylenediphenyl diisocyanate (CAS: 101-68-8). The resulting wood fiber mixturecomprised about 5.5wt% moisture, 4.5 wt% resin, excluding any water, and theremaining part, i.e. 90 wt%, dry wood fibers. This wood fiber mixture was used toform a fiber mat of 12 mm thickness, which was introduced into an HDF board press.The fiber mat was pressed following the same sequence as described above forExample 1. The resulting HDF board had a thickness of about 2 mm, a density of 940 kg/m3 and a moisture content of about 4wt% after pressing.
    Comparative Example The comparative example HDF board was prepared in a similar manner as Examples1 and 2, with the difference that the resin used was a commercially availableMelamine Urea Formaldehyde (MUF). A wood fiber mixture comprised about 8 wt%moisture, 10 wt% resin and the remaining part, i.e. 82 wt%, dry wood fibers. Thiswood fiber mixture was used to form a fiber mat of 12 mm thickness, which wasintroduced into an HDF board press in which an HDF board was formed with athickness of about 2 mm, a density of 940 kg/m3 and a moisture content of about 4wt% after pressing.Results: The HDF boards produced according to the above techniques were exposed todifferent degrees of humidity and were then tested for modulus of elasticity (MoE)according to EN310. Table 1 below presents the test results. The column to the rightin table 1 presents for each example the Modulus of Elasticity at 90% relativehumidity divided by the Modulus of Elasticity at 60% relative humidity. The closer to 1 that this value is the less is the board affected by humidity: 12 Relative 60 % 70 % 80 % 90 % MoE at 90% /Humidity MoE at 60 %Example 1 5700 5200 4700 3200 0.56Example 2 4800 4500 4000 3200 0.67Comparative 5200 4300 2900 2200 0.42Example Table 1. Modulus of Elasticity (MoE), (N/mmz), at different relative Humidity As can be seen from table 1 the HDF board of the Comparative Example is heavilyaffected at high relative humidity. The HDF-boards of Examples 1 and 2 on the otherhand resists humidity much better and at 90% relative humidity still have substantiallymore than 50% of their Modulus of Elasticity at 60% relative humidity.
    The present disclosure is not restricted to the above examples, and may be variedand altered in different ways within the scope of the appended claims. For example, ithas been described hereinabove that all distance elements 14, 19 are made fromHDF boards comprising wood particles bonded by a resin including an isocyanatecomponent. While this is a preferred embodiment, it is in some applications possibleto use some distance elements made from another material. For example, some ofthe distance elements could be made of MDF, having a lower density than HDF.MDF would have a density of less than 800 kg/ms, more typically a density of 600-780 kg/m3. ln such an embodiment at least the distance elements located close tothe edges of the hollow board are preferably made from HDF, while the centraldistance elements may be made from MDF, or another material, since the hollow board is somewhat less sensitive to humidity induced swelling at its central portions. 13
    权利要求:
    Claims (16)
    [1] 1. Hollow board (1) comprising first and second main surface layers (3, 5) and aplurality of distance elements connecting the first and second main surface layersand maintaining a predetermined distance there between, characterized by -each main surface layer (3, 5) including at least a layer of fiberboard having adensity of at least 800 kg/ms (HDF board) and -a plurality of distance elements (14, 19) distributed in a space (16) between the mainsurface layers (3, 5), and at least some of said plurality of distance elements (14, 19)comprising at least one elongate HDF board strip (15) being oriented such that its longitudinal edges (17) interconnect the first and second main surface layers (3, 5), wherein the HDF boards of the surface layers (3, 5) and of the at least some of saidplurality of distance elements (14, 19) comprise wood particles bonded by a resin including an isocyanate component.
    [2] 2. Hollow board according to claim 1, wherein said at least one HDF board strip (15)extends in a plane perpendicular to the plane of the first and second main surface layers (3, 5).
    [3] 3. Hollow board according to claim 1 or 2, wherein the hollow board (1) has a maindirection of extension (7) and the HDF board strip (15) has an elongate direction being parallel with the main direction of extension (7).
    [4] 4. Hollow board according to any of the preceding claims, wherein the HDF boardstrip (15) longitudinal edges (17) that interconnect the main surface layers (3, 5) arecut edges formed by cutting the strip (15) from a HDF board, and wherein the strip(15) side edges (18) being perpendicular to the longitudinal edges (17) have a moresmooth surface than the cut longitudinal edges (17), preferably the strip (15) sideedges (18) being press formed side edges (18).
    [5] 5. Hollow board according to claim 3 or 4, wherein the HDF board strip (15) extendsalong at least 80 %, preferably at least 90%, of the length of the board (1) in the maindirection of extension (7).
    [6] 6. Hollow board according to any of the preceding claims, wherein the plurality ofdistance elements (14, 19) includes at least one stack (19, 21) of glued together HDF 14 board strips (15), wherein the stack (19, 21) is oriented in between the first andsecond surface layers (3, 5) such that individual board strips (15) in the stack (19, 21)interconnect the first and second surface layers (3, 5).
    [7] 7. Hollow board according to claim 6, wherein the at least one stack (19, 21) of gluedtogether HDF board strips (15) comprises 3-10 individual HDF board strips (15),preferably the at least one stack (19, 21) has a width (W) constituting less than 20%of the total width of the hollow board (1 ).
    [8] 8. Hollow board according to claim 6 or 7, wherein at least one stack (19) adjoins aside edge of the hollow board (1 ), preferably the at least one stack (19) adjoining theside edge has a width (W) constituting less than 20% of the total width of the hollowboard (1) perpendicular to that edge.
    [9] 9. Hollow board according to any one of the preceding claims, wherein at least oneconnector element (23, 25) is machined in the hollow board (1) at the location of ablock (19, 21) placed between the surface layers (3, 5), preferably the block being astack (19, 21) of glued together HDF board strips (15), the at least one connectorelement (23, 25) extending at least partly into the block (19, 21), preferably into thestack (19, 21) of glued together HDF board strips (15).
    [10] 10. Hollow board according to claim 9, wherein the at least one block (21) has alength (L) constituting less than 20% of the total length of the hollow board (1 ),preferably the at least one block (21) having a width (W) constituting less than 20%of the total width of the hollow board (1 ).
    [11] 11. Hollow board according to any one of claim 6 to 10, wherein the stack (19, 21) ofHDF board strips (15) are glued together using a polyurethane based reactive hotmelt glue.
    [12] 12. Hollow board according to any of the preceding claims, wherein the plurality ofdistance elements (14, 19) includes both at least one stack (19) of glued togetherHDF board strips (15) and at least one distance element (14) comprising a singleHDF board strip (15), the latter being spaced apart from said at least one stack (19).
    [13] 13. Hollow board according to any of the preceding claims, wherein the first andsecond main surface layers (3, 5) and at least one side edge surface of the hollow board (1) are made from a single piece of HDF board.
    [14] 14. Hollow board according to any of the preceding claims, wherein the isocyanatecomponent of the resin comprises at least one component selected amongmethylene diphenyl di-isocyanate (MDI) and polymethylene polyphenyleneisocyanate, preferably the resin comprising at least 30% of polymethylenepolyphenylene isocyanate and/or methylene diphenyl di-isocyanate (MDI), still morepreferably the resin comprising a 4, 4'-methylene diphenyl di-isocyanateisomerand/or a polymethylene polyphenylene isocyanate that has been formed from a 4, 4'-methylene diphenyl di-isocyanate isomer.
    [15] 15. Hollow board according to any of the preceding claims, wherein the HDF boardcomprises 0.5-15, more preferably 2-10, and most preferably 3-7, wt% of resin,excluding any water, containing the isocyanate component, preferably the HDF boardhaving a density of 850-1 050 kg/m3, preferably the HDF board having a thickness of0.5 - 6 mm, more preferably 1-3.5 mm, preferably the HDF board comprises at least50 wt%, more preferably at least 80 wt%, of dry wood fibers.
    [16] 16. Hollow board according to any of the preceding claims, wherein at least onedistance element (14, 19) is glued to the first and second main surface layers (3, 5)using a hotmelt glue, preferably a polyurethane based reactive hotmelt glue. 16
    类似技术:
    公开号 | 公开日 | 专利标题
    AU599660B2|1990-07-26|Preparation of laminated material
    US4610913A|1986-09-09|Long wafer waferboard panels
    DE60032125T2|2007-09-20|COMPOSITE ELEMENTS AND MANUFACTURING METHOD
    EP3066272B1|2018-04-04|Core layer having wood elements, in particular wood elements having a corrugated structure
    CN103231425B|2016-08-31|A kind of Large-specification recombination composite structural wood and manufacture method thereof
    US11247438B2|2022-02-15|Hollow board
    CN104411491B|2017-03-08|By have there is in core and two outer layers and core treated paper pulp, multilamellar light weight wood-base materials that the ligno-cellulosic materials of treated natural fiber, synthetic fibers or its mixture form
    CN101885194B|2012-07-04|Glued bamboo board and preparation method thereof
    EP2569154A1|2013-03-20|Multi-layer wood veneer moulding
    DE202012105040U1|2013-01-29|plywood
    Sam-Brew et al.2011|Preliminary experiments on the manufacture of hollow core composite panels
    CN101090937A|2007-12-19|Wood composite material containing paulownia
    BRPI0713449A2|2012-01-31|wood composite material
    US20220080708A1|2022-03-17|Hollow board
    CN103231423B|2015-12-02|A kind of laminate bamboo radical fiber composite material and manufacture method thereof
    Smardzewski et al.2018|Auxetic structures in layered furniture panels
    CN203282556U|2013-11-13|Hollow chamfered joint recombination bamboo structure wood
    CN103231424B|2015-12-23|A kind of hollow bamboo base fiber compound structure material and manufacture method thereof
    US11001411B2|2021-05-11|Pallet comprising folded wooden composite
    JP3218824B2|2001-10-15|Wood board
    EP0199511A2|1986-10-29|Long wafer waferboard panels
    JP5511586B2|2014-06-04|Wood composite
    EP2113350B1|2019-01-16|Board manufactured with two layers and material between them
    JPH0740314A|1995-02-10|Wooden board
    PLYWOOD1979|Department of Forestry
    同族专利:
    公开号 | 公开日
    WO2018004430A1|2018-01-04|
    EP3475083A1|2019-05-01|
    US11247438B2|2022-02-15|
    US20190255816A1|2019-08-22|
    SE542245C2|2020-03-24|
    CN109476126A|2019-03-15|
    EP3475083A4|2020-01-29|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US2073896A|1935-03-28|1937-03-16|Emil C Loctscher|Hollow panel|
    FR832590A|1937-02-27|1938-09-29|Halbertsma S Fabrieken Voor Ho|Wood composite panel for partitions, wall coverings, doors, etc.|
    EP2300205A4|2008-06-08|2013-06-19|Robert N Clausi|Process for producing resilient wood particleboard, mdf and hdf|
    US8865287B2|2008-08-13|2014-10-21|Robert A. Haupt|Rapid curing aldehyde resin-polyisocyanate composition and method for producing hybrid polymer|
    WO2010049418A1|2008-10-31|2010-05-06|Swedwood Poland Sp.Z.O.O.|A laminated board, and a method for providing such laminated board|
    RU2533834C2|2009-06-16|2014-11-20|ХАНТСМЭН ИНТЕРНЭШНЛ ЭлЭлСи|Reaction system and method of obtaining lignocellulose product|
    US20110271625A1|2009-11-10|2011-11-10|Jeld-Wen, Inc.|Thin-layer composites including cellulosic andnoncellulosic fibers and methods of making the same|
    US8534018B2|2010-08-24|2013-09-17|James Walker|Ventilated structural panels and method of construction with ventilated structural panels|
    WO2012048738A1|2010-10-13|2012-04-19|Ikea Supply Ag|Method of continuous manufacture of a composite hollow board material, and machine and computer program|
    DE102011115897A1|2011-05-14|2012-11-15|Kettler Consulting & Engineering|Lightweight panel, method for manufacturing and apparatus for manufacturing|
    EP2620458A1|2012-01-26|2013-07-31|Huntsman International LLC|Wood adhesive formulation|
    US8935899B2|2012-02-02|2015-01-20|Valinge Innovation Ab|Lamella core and a method for producing it|
    AU2014205040A1|2013-01-11|2015-07-30|Mmw Equine Therapy Pty Ltd|Composite boards comprising cellulosic plant material|
    US9868857B2|2014-12-30|2018-01-16|Georgia-Pacific Chemicals Llc|Composite products containing a powdered binder and methods for making and using same|
    SE539656C2|2015-07-03|2017-10-24|Ikea Supply Ag|A method of and a device for producing a panel-shaped building element made from a fibrous sheet|SE543038C2|2018-04-24|2020-09-29|Ikea Supply Ag|Fiberboard and method of forming a fiberboard|
    CN110978195A|2019-12-27|2020-04-10|惠州市欧易科技有限公司|Triamine plate component and production process thereof|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1650917A|SE542245C2|2016-06-27|2016-06-27|Hollow board|SE1650917A| SE542245C2|2016-06-27|2016-06-27|Hollow board|
    EP17820648.8A| EP3475083A4|2016-06-27|2017-06-26|Hollow board|
    US16/313,453| US11247438B2|2016-06-27|2017-06-26|Hollow board|
    CN201780039846.8A| CN109476126A|2016-06-27|2017-06-26|Hollow plate|
    PCT/SE2017/050700| WO2018004430A1|2016-06-27|2017-06-26|Hollow board|
    [返回顶部]